The development of thin film-based structures/devices often requires thin films to be transferred onto
arbitrary substrates/surfaces. Controllable and non-destructive transfer method, although highly desired,
remains quite challenging. Here we report a general method for fabrication and transfer of hybrid
(ultra)thin films. The proposed solution-based in-situ transfer method shows not only its robust ability for
thin film transfer onto arbitrary substrates but also its highly controlled and non-destructive characteristic.
With a hole structure as the support, fully-stretched free-standing thin film is prepared. The successful
transfer to a curved surface demonstrates the possibility for production of thin film-coated complex optical
components. Ultrathin (35 nm) hybrid film transferred onto PET (50
m
m thick) shows high transparency
(
.
90% in visible range), conductivity (1.54
3
10
4
S/m), and flexibility (radius of curvature down to mm
scale). The reported transfer method would provide a powerful route towards complex thin film-based
structures/devices
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John J Magan,
Werner Blau,
Yong Zhang